TFC’s thick film technology is traditionally an additive process, that is the various components are produced on the substrate by applying ‘inks’ (or ‘pastes’) and are added sequentially to produce the required conductor patterns and resistor values.
Different formulations of paste are used to produce
- conductors
- resistors
- dielectrics (for crossovers or, occasionally, capacitors)
TFC’s paste suppliers are world famous brand like DuPont, Heraeus and other:
DuPont is a leading supplier of thick film hybrid circuit materials for advanced electronic applications worldwide.
DuPont offer the broadest selection of hybrid circuit materials, providing high reliability across different substrates, operating environments, temperatures, and metallizations. DuPont’s extensive offering consists of material systems with proven compatibility including a full line of conductors, dielectric materials, resistor materials, encapsulants, and Fodel® photoimageable materials.
DuPont’s hybrid circuit materials are relied upon every day in satellite communications, automotive electronics, guidance systems, aerospace, defense/homeland security, telecommunications, and consumer electronics.
