Up to now, SMT is the most popular technology and technique in the industry of Printed Circuit Board Assembly (PCBA). Since its advent into market at the beginning of 1970s, SMT has become the main trend of modern electronic assembly industry, replacing wave soldering assembly that has to depend on manual insertion. This process has been regarded as the second revolution of electronic assembly technology. Put it in another way, SMT has been a global trend in international PCBA, leading to a large transformation of the whole electronic industry.
Moreover, SMT has pushed electronic components towards chip type, miniature, thinness, light weight, high reliability and multiple functions and it has been a symbol indicating a nation’s scientific progress degree.
Technique and Attributes of SMT
SMT refers to a type of PCB assembly technology through which SMDs (Surface Mount Devices) are mounted on the surface of PCBs through some technique, equipment and materials coupled with soldering, cleaning and testing to complete assembly.
• SMT technique
SMT technique can be classified into different types according to soldering method and assembly method.
a. Based on soldering method, SMT technique can be classified into two categories: reflow soldering and wave soldering.
b. Based on assembly method, SMT technique can be classified into full-surface assembly, single-sided mix assembly and double-sided mix assembly.